Semiconductor package with high routing density patch

ABSTRACT

Methods and systems for a semiconductor package with high routing density routing patch are disclosed and may include a semiconductor die bonded to a substrate and a high routing density patch bonded to the substrate and to the semiconductor die, wherein the high routing density patch comprises a denser trace line density than the substrate. The high routing density patch can be a silicon-less-integrated module (SLIM) patch, comprising a BEOL portion, and can be TSV-less. Metal contacts may be formed on a second surface of the substrate. A second semiconductor die may be bonded to the substrate and to the high routing density patch. The high routing density patch may provide electrical interconnection between the semiconductor die. The substrate may be bonded to a silicon interposer. The high routing density patch may have a thickness of 10 microns or less. The substrate may have a thickness of 10 microns or less.

FIELD

Certain embodiments of the disclosure relate to semiconductor chippackaging. More specifically, certain embodiments of the disclosurerelate to a method and system for a semiconductor package having a highrouting density patch which can comprise a silicon-less integratedmodule (SLIM).

BACKGROUND

Semiconductor packaging protects integrated circuits, or chips, fromphysical damage and external stresses. In addition, it can provide athermal conductance path to efficiently remove heat generated in a chip,and also provide electrical connections to other components such asprinted circuit boards, for example. Materials used for semiconductorpackaging typically comprise ceramic or plastic, and form-factors haveprogressed from ceramic flat packs and dual in-line packages to pin gridarrays and leadless chip carrier packages, among others.

Further limitations and disadvantages of conventional and traditionalapproaches will become apparent to one of skill in the art, throughcomparison of such systems with the present disclosure as set forth inthe remainder of the present application with reference to the drawings.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 illustrates a semiconductor package with top die bonded to a highrouting density patch, in accordance with an example embodiment of thedisclosure.

FIGS. 2A-2D illustrate example steps in forming the semiconductorpackage with top die bonded to a high routing density patch, inaccordance with an example embodiment of the disclosure.

FIG. 3 illustrates a semiconductor package with backside mounted highrouting density patch, in accordance with an example embodiment of thedisclosure.

FIGS. 4A-4D illustrate example steps for forming a semiconductor packagewith backside mounted high routing density patch, in accordance with anexample embodiment of the disclosure.

FIG. 5 illustrates a semiconductor package with a high routing densitypatch on an interposer, in accordance with an example embodiment of thedisclosure.

FIGS. 6A-6C illustrate example steps in forming a semiconductor packagewith a high routing density patch on an interposer, in accordance withan example embodiment of the disclosure.

DETAILED DESCRIPTION

Certain aspects of the disclosure may be found in a semiconductorpackage with high routing density patch, which can comprise asilicon-less integrated module (SLIM) to increase routing density.Example aspects of the disclosure include an electronic devicecomprising a semiconductor die bonded to a first surface of a substrateand a high routing density patch bonded to the substrate, wherein thehigh routing density patch comprises a denser trace line density thanthe first substrate. In some examples, the routing density of the highrouting density patch can be in the submicron range. The electronicdevise may also comprise an encapsulant encapsulating at least a portionof the semiconductor die, the high routing density patch, and the firstsurface of the substrate encapsulated utilizing an encapsulant, as wellas metal contacts on a second surface of the substrate. A secondsemiconductor die may be bonded to the first surface of the substrateand the high routing density patch. The high routing density patch mayprovide electrical interconnection between the semiconductor die and thesecond semiconductor die. The substrate may be on an interposer, whichmay comprise silicon. The high routing density patch may have athickness of 10 microns or less. The metal contacts may comprise solderballs. The substrate may have a thickness of 10 microns or less.

FIG. 1 illustrates a semiconductor package with top die bonded to a highrouting density patch, in accordance with an example embodiment of thedisclosure. Referring to FIG. 1, there is shown a package 100 comprisingsemiconductor die 101A and 101B, high routing density patch 103,substrate 105, underfill material 107, metal contacts 109, contactstructures 111, under bump metal (UBM) 113, and encapsulant 115. As canbe seen in FIG. 1, patch 103 can be located between a surface ofsemiconductor die 101A/B and a surface of substrate 105, but patch 103need not cover all of the such surface of semiconductor die 101A/B, andmay extend past a perimeter of such surface of semiconductor die 101A/B.

The die 101A and 101B may each comprise an integrated circuit dieseparated from a semiconductor wafer, and may comprise electricalcircuitry such as digital signal processors (DSPs), network processors,power management units, audio processors, RF circuitry, wirelessbaseband system-on-chip (SoC) processors, sensors, and applicationspecific integrated circuits, for example.

The patch 103 may, for example, comprise a thin high routing densitypatch that can provide high density interconnects between thesemiconductor die 101A/101B, and/or between the die 101A/101B and thesubstrate 105. In the present example, patch 103 may comprise asilicon-less integrated module (SLIM) patch, such that there issubstantially no silicon or other semiconductor in its layeredstructure, and/or no through-semiconductor via (TSV) therethrough. Patch103 may be produced with two portions in some SLIM embodiments. ABack-End-Of-the-Line (BEOL) portion (see e.g. portion “a” of inset inFIG. 1) of the SLIM patch can be fabricated to comprisesemiconductor-fab-style BEOL interconnection layers, which can compriseinorganic dielectric materials, such as SiN, SiO₂, or oxy-nitride,and/or which can be devoid of organic dielectric materials. An RDLportion (see e.g. portion “b” of inset in FIG. 1) of the SLIM patch canbe formed to comprise a post-fab redistribution layer (RDL) formed onthe BEOL portion, and can have organic dielectric materials such aspolyimide, and/or PBO. In some examples, the thickness of the BEOLportion can be greater than the thickness of the RDL portion of the SLIMpatch. In the same or other examples, the BEOL portion of the SLIM patchcan comprise a greater number of conductive layers than the RDL portionof the SLIM patch. As a non-limiting example, in some implementationsinorganic BEOL can produce more planar layers than those produced viaRDL with organic dielectrics, such that the BEOL portion of the patchcan have 3 or more conductive layers, while the RDL portion may need tobe limited to 3 or less conductive layers due to planarity concerns.Notwithstanding the above, there can be examples where the BEOL portioncan comprise less than 3 conductive layers. In the same or otherexamples, the separation and/or the dielectric between conductive layersin the BEOL portion of the SLIM patch can be thinner than in the RDLportion of the SLIM patch. There can be examples, however, where theSLIM patch can comprise the BEOL portion without the RDL portion. Therecan also be examples where patch 103 need not be a SLIM patch but stillcomprises higher routing density than substrate 105.

The conductive layer(s) in the patch 103 may comprise copper, nickel,and/or gold, for example. The SLIM structure can be substantially devoidof semiconductor material, such as in a silicon or glass interposer,because silicon and glass are more lossy compared to thedielectric/metal structure of the SLIM structure. Furthermore, SLIMstructures can be thinner than silicon or glass interposers, and/or canprovide finer pitch for conductive traces thereat.

The patch 103 may be 5-10 μm thick (or, for example, <5 μm thick), andmay comprise rows and/or columns of interconnections with high routingdensity, such as 0.5-1.0 μm line and/or line spacing between lines (or,for example, <0.5 μm lines or line spacing), and/or a 30 μm pitch forthe columns (or, for example, <30 μm pitch), for example, but thedisclosure is not so limited as larger or smaller trace line or linespacing size/pitch may be utilized depending on the desired interconnectdensity. The patch 103 may comprise one or more metal layers 106 anddielectric layers 108 (see, e.g., FIG. 2A) to provide isolated highdensity electrical interconnection for devices and structures coupled tothe patch 103.

The substrate 105 may comprise a substrate with a dielectric/metallayered structure, but may have lower routing density, enabling a lowercost structure than the higher cost high routing density interconnectsof patch 103. Substrate 105 may comprise one or more metal layers 116and dielectric layers 118 (see, e.g., FIG. 2A) to provide isolatedelectrical interconnection for devices and structures coupled to thesubstrate. In some examples, substrate 105 may be a SLIM similar to theSLIM version of patch 103 as described above, but can comprise lowerrouting density than patch 103.

The underfill material 107 may be utilized to fill the space between thedie 101A/101B, and/or between the die 101A/101B and the substrate 105,and/or between the die 101A/101B and the patch 103. Underfill material107 may provide mechanical support for the bond between the die101A/101B and the substrate 105, and between the die 101A/101B and thepatch 103, as well as provide protection for the metal contacts 109. Theheight of the underfill material may be on the order of 10-25 μm, forexample. The underfill material 107 may comprise a pre-applied underfillor a capillary underfill applied following the bonding of the die101A/101B to the substrate 105. In an example scenario, the underfillmaterial 107 may comprise a non-conductive paste.

The encapsulant 115 may comprise an epoxy material or mold compound, forexample, that may protect the die, patch 103, and substrate 103 from theexternal environment and provide physical strength for the package 100.It should be noted that the encapsulant is an optional structure, andmay be excluded when the substrate 105 provides enough physical strengthfor the package 100, for example.

The metal contacts 109 may comprise various types of metal (orconductive) interconnects for bonding a die to a substrate, such asmicro-bumps, metal pillars, solder bumps, solder balls, for example. Inan example scenario, the metal contacts 109 comprise copper pillars witha solder bump (or cap) for reflowing and bonding to contact pads on thesubstrate 105. In the same or other examples, metal contacts 109 maycomprise a fine pitch of approximately 20-50 μm, and/or a coarse pitchof approximately 90-100 μm.

The contact structures 111 may comprise metal pillars, solder bumps,solder balls, microbumps, or lands, for example. The contact structuresmay have different size ranges, such as bumps of 100-200 μm, or microbumps/pillars of 20-100 μm. In instances where solder bumps are used,the contact structures may comprise one or more solder metals that meltat a lower temperature than the other metals, such that upon melting andsubsequent cooling, the contact structures 111 provide mechanical andelectrical bonding between the semiconductor package 100 and an externalcircuit board or other package. The contact structures 111 may comprisea ball grid array (BGA) or land grid array (LGA), for example. Thoughsolder balls are illustrated, the contacts 111 may comprise any of avariety of types of contacts.

The UBM 113 may comprise thin metal layer(s) formed on the substrate 105for receiving the contact structures 111. The UBM 113 may comprise asingle or multiple layers comprising materials such as copper,chrome/chrome-copper alloy/copper (Cr/Cr—Cu/Cu), titanium-tungstenalloy/copper (Ti—W/Cu), aluminum/nickel/copper (Al/Ni/Cu), or othersuitable metal for making contact with the substrate 105 and the contactstructures 111.

The cost to design an entire system-on-chip (SOC) into finer CMOStechnology nodes, such as 10 nm CMOS (i.e., 10 nm gate length CMOSprocess) can be prohibitive. Die sizes are not shrinking fast, due tosome components in the die that do not scale down in x-y size at thenext technology node. SRAM used for L0 or L1 cache is an example of diesize not scaling down with gate size. The net outcome is that 10 nmdefect density of the 10 nm node may be much higher due to manufacturingcomplexity, and may double the cost of 14/15 nm CMOS per wafer, whilethe resulting die size is not reduced much, if at all.

For these reasons, the 10 nm silicon CMOS node may advantageously beutilized for those items where the payback in performance (from thefaster transistors) is needed (e.g. CPU cores, GPU cores, etc.), and theother functions of the die may be adequately fabricated in an oldernode, for example 28 nm or 14 nm. This means breaking what hashistorically been a single die SOC into a multi-die solution, where thefunctionality of the separate die is re-integrated at the IC packagelevel. This is called “die split” or “die deconstruction”. Variousplatforms for such a design may utilize a through-semiconductor via(TSV) or through-glass via (TGV) interposer approach. However, such aninterposer may be relatively costly and thick (50-200 μm, at least), soto permit a lower cost and smaller device, especially for smallerpackages such as those in the mobile market, the high routing densitypatch and/or substrate of the present disclosure may be utilized.

It should be noted that the SLIM patch/substrate is not only applicableto technology nodes at or lower than 10 nm. Accordingly, the SLIMpatch/substrate may be used in any application where high densityinterconnects are desired, particularly in a small area where a patchmay be most space and cost effective. For example, SLIM patch/substratesmay be used with 14 nm technology.

In a die split, the required signal routing density may be verydemanding for the areas of the two die immediately adjacent to oneanother, as illustrated in the inset of FIG. 1. Although there may be alarger die quantity, two die are shown simply for illustrative purposeshere. The cost of SLIM may, for example, be driven by 1) the layercount, and 2) the line thickness and spacing required. For example, ifthe entire SLIM structure could be routed with 1 layer of 2 μm line and2 μm spaces, this would be quite economical. However, as seen in theinset of FIG. 1, routing requirements between the die or in other areasmay be more demanding, requiring more layers, and/or higher column,line, or line-spacing density, which increases costs significantly. Ifthere is even one small location on the SLIM substrate with 0.5/0.5 μmline and/or line spacing (for example), the cost of the entire substratewill be at that routing premium. As shown in FIG. 2A, the substrate 105may be SLIM formed on wafer 201, which may comprise silicon, forexample, during BEOL processing, and then removed for the finishedpackage 100. In another example scenario, a thin layer of the silicon ofwafer 201 may be left on substrate 105.

In an example scenario, if an area needing higher routing density, i.e.,the area shown in the inset of FIG. 1, could be interconneced using ahigh routing density patch, such as the patch 103, then the overallpackage cost could be lower because the remainder of the area notneeding such high routing density can be properly serviced with lowercost lower density routing, such as that provided by substrate 105. Awafer comprised of these smaller high routing density patches wouldproduce a large number of units and thus the price per high routingdensity patch would be smaller. The non-high routing density substrate(e.g., substrate 105) spanning the x-y dimensions of both die could havecoarser line and/or line spacing density (e.g. 2 μm/2 μm, line and linespacing, or greater) than those of the high routing density patch.

FIGS. 2A-2D illustrate example steps in forming the semiconductorpackage with top die bonded to a high routing density patch, inaccordance with an example embodiment of the disclosure. FIGS. 2A-2D mayshare any and all features of FIG. 1. Referring to FIG. 2A, there isshown the patch 103 and the substrate 105. The patch 103 may be bondedto the substrate 105 utilizing corresponding metal contacts on the patch103 and substrate 105. In some examples, however, patch 103 may bebonded to substrate 105 via an adhesive, and/or need not be electricallycoupled directly to substrate 105, being intended in such cases toprovide interconnection only between semiconductor die 101A and 101B.

In an example scenario, the substrate 105 and the patch 103 and may beformed on or supported by thicker support structures, like substrates201 and 203 respectively, that may be in wafer or die form, for example.In an example scenario, the substrate 201 may comprise a silicon orglass wafer, and the substrate 203 may comprise a silicon or glass diethat was diced wafer. Alternatively, the substrates 201 and 203 may bothbe in wafer form.

The patch 103 may be bonded to the substrate 105 utilizing variousbonding technologies (e.g., adhesive, thermo-conductive bonding,relatively high-temperature reflow, etc.). In instances where the patch103 includes the substrate 203 for physical support when handling andbonding to the substrate 105, the substrate 203 may be substantially orfully removed before or after bonding.

Referring to FIG. 2B, the die 101A/101B may be bonded to both the patch103 and the substrate 105. In an example scenario, a reflow process maybe utilized to bond the metal contacts 109 to the patch 103 andsubstrate 105. The metal contacts 109 may comprise metal pillars withsolder bumps, for example, where the pillars can have different heightdepending on whether they are bonded to the patch 103 or the substrate105. In an example scenario, the pillars may comprise differentcross-sectional shapes, widths, and/or pitch, for example,

FIG. 2C illustrates the application of underfill material 107 to thestructure of FIG. 2B, which may be applied in a capillary underfillprocess, for example, although the underfill material 107 may instead bepre-applied prior to bonding the die 101A/101B. In addition, FIG. 2Cillustrates the UBM 113 applied to the bottom surface of the substrate105. A passivation layer may be applied to the backside of the substrate105 with openings for the subsequent formation of the UBM 113.Accordingly, the substrate 105 may comprise metal contacts andpassivation layers on top and bottom surfaces for isolation andprotection from environmental contaminants.

The semiconductor die 101A and 101B and the underfill 107 may beencapsulated by the encapsulant 115 for environmental protection and/orphysical strength of the package. The encapsulant 115 is an optionalstructure, and may be excluded when the substrate 105 provides enoughphysical strength for the package 100, for example. In instances whenthe encapsulant 115 is utilized, the substrate 201 may be removed byetching or chemical-mechanical polishing, for example.

Finally, in FIG. 2D, the contact structures 111 may be placed on the UBM113, resulting in the final structure, the semiconductor package 100.The contact structures 111 may comprise solder balls, for example, forbonding to an external printed circuit board or other device. Note,however, that any of a variety of contacts structures may be utilized.

FIG. 3 illustrates a semiconductor package with backside mounted highrouting density patch, in accordance with an example embodiment of thedisclosure. FIG. 3 may share any and all of the corresponding featuresof FIGS. 1-2. Referring to FIG. 3, there is shown semiconductor package300 comprising semiconductor die 301A and 301B, patch 303, substrate305, underfill material 307, metal contacts 309, contact structures 311,UBM 313, underfill material 315, and patch contacts 317.

In this example, the patch 303, which can comprise a high routingdensity patch similar to patch 103, may be bonded to the bottom surfaceof the substrate 305, which can be similar to substrate 105. As thethickness of the patch 303 may be on the order of 5 μm thick or evenless, and a few millimeters per side in area, it does not preclude theuse of BGA bonding of the semiconductor package 300 or the utilizationof any of a variety of different contact structures having a standoffgreater than 5 μm. Similarly, the substrate 305 can comprise a SLIMsubstrate, but with lower routing density compared to the patch 303.

The underfill material 315 may be utilized to fill the space between thepatch 303 and the substrate 305, and may provide mechanical support forthe bond between the structures as well as provide protection for thepatch contacts 317. The underfill material 315 may, for example,comprise a pre-applied underfill or a capillary underfill appliedfollowing the bonding of the patch 303 to the substrate 305. In anexample scenario, the underfill material 313 may comprise anon-conductive paste.

The patch contacts 317 may comprise various types of metal interconnectsfor bonding the patch 303 to the substrate 305, such as micro-bumps,metal pillars, solder bumps, solder balls, etc.

FIGS. 4A-4D illustrate example steps for fabricating a semiconductorpackage with backside mounted high density patch, in accordance with anexample embodiment of the disclosure. FIGS. 4A-4D may share any and allof the corresponding features of FIGS. 1-3. Referring to FIG. 4A, thedie 301A/301B may be bonded to the substrate 305 utilizing the metalcontacts 309. The substrate 305 may comprise a SLIM substrate with adielectric/metal layered structure on the order of 5-10 μm thick, andmay comprise contact pads in the metal layer 306 for receiving the metalcontacts 309, and dielectric layers 308 for isolating metalinterconnections in the substrate 305.

The metal contacts 309 may comprise various types of metal interconnectsfor bonding a die to a substrate, such as metal pillars, solder balls,micro-bumps, etc. In an example scenario, the metal contacts 309comprise copper pillars with a solder bump (or cap) for a reflow processto bond the metal contacts 309 to the contact pads in the metal layer306 on the substrate 305.

In FIG. 4B, underfill material 307 may be applied in a capillaryunderfill process, for example. In another example scenario, theunderfill material 307 may be a pre-applied underfill material thatassists in bonding the metal contacts 309 to the substrate 305.

FIG. 4B also shows the forming of the UBM 313 on the bottom surface ofthe substrate 305 for receiving contact structures 311. Accordingly, thesubstrate 305 may comprise contact pads in the metal layers 308 forreceiving the UBM 313 and passivation layers on top and bottom surfacesfor electrical isolation and protection from environmental contaminants.

In FIG. 4C, the patch 303 may be bonded to the bottom surface of thesubstrate 305 utilizing metal contacts (not shown) in the metal layers306 on the substrate 305 and like layers on the patch 303. An underfillmaterial 315 may be pre-applied on the substrate 305 or may appliedbetween the substrate 305 and the patch 303 after bonding in a capillaryunderfill process. The underfill material 315 may assist in the bondingprocess of the patch 303 to the substrate 305.

Finally, the contact structures 311 may be formed on the UBM 313,resulting in the final structure, the semiconductor package 300. Areflow process may be utilized to adhere the contact structures 311,which may comprise solder balls, for example, to the UBM 313. Asexplained herein, the method and structure shown and discussed withregard to FIG. 4 may share any or all characteristics with other methodsand structures discussed herein. For example, in an exampleimplementation patches may be coupled to both sides of the substrate. Inaddition, die may also be bonded to both sides of the substrate.

FIG. 5 illustrates a semiconductor package with a high density patch onan interposer, in accordance with an example embodiment of thedisclosure. Referring to FIG. 5, there is shown semiconductor package500 comprising semiconductor die 501A and 501B, patch 503, substrate505, underfill material 507, metal contacts 509, and interposer 510.FIG. 5 may share any and all of the corresponding features of FIGS. 1-4.For example, patch 503 can be similar to patch 103, and/or substrate 505can be similar to substrate 105.

In this example, the patch 503, which can comprise a high routingdensity patch, may be bonded to the top surface of interposer 510. Thethickness of the structures in FIG. 5 are not to scale. For example,interposers in general are much thicker than the SLIM structures, thepatch 503 and substrate 505, on the order of 50-200 μm, for example. Inaddition, by incorporating high routing density interconnects in thepatch with a standard interposer structure, costs may be greatlyreduced, since by incorporating the patch 503, the layer count of thethin film routing in the interposer 510 may be reduced.

FIGS. 6A-6C illustrate example steps in fabricating a semiconductorpackage with a high routing density patch on an interposer, inaccordance with an example embodiment of the disclosure. FIGS. 6A-6C mayshare any and all of the features of FIGS. 1-5. Referring to FIG. 6A,there is shown interposer 510, patch 503, and substrate 505. The patch503 and/or the substrate 505 may comprise SLIM structures comprisingmetal and dielectric layers as described above with respect to patch 103and substrate 105 respectively.

The substrate 505 is shown in cross-section in FIG. 6A and may comprisea SLIM substrate with an opening in the center where the patch 503,which can comprise a SLIM high density patch, may be bonded to theinterposer 510. The substrate 505 may comprise one or more metal layers506 and dielectric layers 508, and may comprise substantially no siliconin its layered structure, which may be more lossy for electricalsignals.

The interposer 510 (and any interposer discussed herein) may comprise,for example, a silicon or glass interposer with TSVs, or a laminateinterposer, with insulating and conductive materials for providingelectrical contact between the die 501A/501B and a structure to whichthe interposer 510 is bonded, either via the patch 503 or the substrate505. Metal contacts in or on the metal layers 506 in the substrate 505may be electrically coupled to vias 512 in the interposer 510, as shownin FIG. 6A with the resulting structure shown in FIG. 6B.

FIG. 6B shows the die 501A/501B being bonded to the patch 503 and thesubstrate 505 utilizing the metal contacts 509. The metal contacts 509may comprise various types of metal interconnects for bonding a die to asubstrate, such as metal pillars, solder balls, micro-bumps, etc. In anexample scenario, the metal contacts 509 comprise copper pillars with asolder bump (or cap) for a reflow process to bond the metal contacts 509to contact pads in the metal layer 506 on the substrate 505.

The metal contacts 509 may be of different height based on whether theyare bonded to the patch 503 or substrate 505, in instances where thethickness of these structures are different. The patch 503 may bethicker than the substrate 505 when the patch comprises multiple layersfor a large number of high routing density interconnections between thedie 501A and 501B and other structures coupled to the interposer 510.Alternatively, the patch 503 may be thinner than the substrate 505(e.g., resulting in longer metal contacts 509 for connection to thepatch 503 than for connection to the substrate 505) or the samethickness (e.g., resulting in a generally consistent contact length forboth connection to the patch 503 and the substrate 505).

An underfill material 507 may be formed between the die 501A/501B andthe substrate 505 and the patch 503 as well as between the die501A/501B. In an example scenario, the underfill material 507 may beformed in a capillary underfill process. In an alternative scenario, theunderfill material 507 may be pre-applied underfill and assist inbonding the metal contacts 509 to the substrate 510. The resultingstructure is shown in FIG. 6C.

The interposer 510, for example, may comprise a silicon substrate withTSVs 512 for electrically coupling the die 501A and 501B to an externalprinted circuit board or other external devices via the metal contacts509 and the patch/substrate 503/505. By incorporating a high routingdensity patch, the patch 503, with the interposer 510, costs may begreatly reduced, since the patch 503 includes the high densityinterconnects such that the layer count of the thin film routing in theinterposer 510 may be reduced.

Other variations are envisioned. For example, substrate 105 (FIGS. 1-2)and/or substrate 305 (FIGS. 3-4) can be or can be referred to as aninterposer, which may be similar to interposer 510 in someimplementations. Also, as described with respect to FIGS. 1-4, it ispossible to mount a SLIM patch to a substrate, and then bond the die tothe overall combination of SLIM +substrate, with or without aninterposer. In some cases, several SLIM patches may be bonded to asubstrate to allow multiple die to connect in this manner. For example,substrate(s) 505 in FIGS. 5-6 can be in patch form similar to patch 503,whether in SLIM format and/or with lower routing density or not, and/orwhether coupled to interposer 510 or to a non-SLIM substrate. As anotherexample, FIGS. 1-4 can inherently comprise a combination of multiplepatches 103 and/or 303 to permit further interconnectivity betweenmultiple die.

In an embodiment of the disclosure, a method and system are disclosedfor a semiconductor package having a high routing density patch whichcan comprise a silicon-less integrated module (SLIM). In this regard,aspects of the disclosure may comprise bonding a semiconductor die to afirst surface of a substrate and a high routing density patch bonded tothe substrate. The semiconductor die, the high routing density patch,and the substrate may be encapsulated utilizing an encapsulant.

Metal contacts may be formed on a second surface of the substrate. Asecond semiconductor die may be bonded to the first surface of thesubstrate and the high routing density patch. The high routing densitypatch may provide electrical interconnection between the semiconductordie. The substrate may be bonded to an interposer. The high routingdensity patch may have a thickness of 10 microns or less. The metalcontacts may comprise solder balls. The substrate may have a thicknessof 10 microns or less.

A portion of the thickness of the high routing density patch maycomprise alternating layers of metal and inorganic dielectric layers(BEOL structure) and another portion of the thickness of the highrouting density patch may comprise alternating layers of metal andorganic dielectric layers.

In one embodiment of the disclosure, a semiconductor die may be bondedto a first surface of a substrate and a high routing density patchbonded to a second surface of the substrate opposite to the firstsurface, wherein the substrate and the high routing density patchcomprise no semiconductor layers. At least a portion of thesemiconductor die and the substrate may be encapsulated utilizing anencapsulant and metal contacts may be on the second surface of thesubstrate.

A second semiconductor die may be bonded to the first surface of thesubstrate. The high routing density patch may provide electricalinterconnection between the semiconductor die and the secondsemiconductor die. The high routing density patch may have a thicknessof 10 microns or less.

In some examples, there can be embodiments where substrate 105, 305,and/or 505 need not be a SLIM substrate, but can be, for example, alaminate interposer or a silicon/ glass interposer with vias, such asdescribed with respect to interposer 510.

While the disclosure has been described with reference to certainembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted withoutdeparting from the scope of the present disclosure. In addition, manymodifications may be made to adapt a particular situation or material tothe teachings of the present disclosure without departing from itsscope. Therefore, it is intended that the present disclosure not belimited to the particular embodiments disclosed, but that the presentdisclosure will include all embodiments falling within the scope of theappended claims.

1. A method for semiconductor packaging, the method comprising:receiving a high routing density patch comprising: semiconductormaterial; at least one conductive layer on the semiconductor material;and at least one inorganic dielectric layer on the semiconductormaterial; removing at least substantially all of the semiconductormaterial from the high routing density patch; bonding the high routingdensity patch to a first surface of a substrate; and bonding asemiconductor die to the first surface of the substrate and to the highrouting density patch, wherein the high routing density patch comprisesa denser trace line density than the first substrate.
 2. The methodaccording to claim 1, comprising bonding a second semiconductor die tothe first surface of the substrate and the high routing density patch,wherein the high routing density patch provides electricalinterconnection between the semiconductor die and the secondsemiconductor die.
 3. The method according to claim 1, wherein the highrouting density patch is formed in a Back End Of Line (BEOL) waferfabrication process and is TSV-less.
 4. An electronic device comprising:a substrate; a high routing density patch bonded to a first surface ofthe substrate; and a semiconductor die bonded to the first surface ofthe substrate and to the high routing density patch, wherein the highrouting density patch comprises a denser trace line density than thesubstrate, and wherein the high routing density patch comprises a dicedand thinned portion of a semiconductor wafer formed in a Back End OfLine (BEOL) wafer fab process.
 5. The device according to claim 4,comprising a second semiconductor die bonded to the first surface of thesubstrate and to the high routing density patch.
 6. The device accordingto claim 5, wherein the high routing density patch provides electricalinterconnection between the semiconductor die and the secondsemiconductor die.
 7. The device according to claim 4, comprising aninterposer different from the high routing density patch, on which thesubstrate is positioned.
 8. The device according to claim 7, wherein theinterposer comprises silicon.
 9. The device according to claim 4,wherein the high routing density patch is: 10 microns or less inthickness.
 10. The device according to claim 4, wherein the high routingdensity patch comprises trace lines at a spacing of approximately 1 μmor less, and the substrate comprises no trace lines at a spacing of lessthan 1 μm.
 11. The device according to claim 4, wherein the substrate is10 microns or less in thickness.
 12. The device according to claim 4,comprising: an underfill material between the semiconductor die and thehigh routing density patch, but not between the entire semiconductor dieand the substrate; and an encapsulant material that encapsulates atleast a portion of the semiconductor die, the high routing densitypatch, the first surface of the substrate, and the underfill material.13. The device according to claim 4, wherein a first portion of athickness of the high routing density patch comprises an inorganicdielectric and metal layer structure.
 14. The device according to claim13, wherein a second portion of the thickness of the high routingdensity patch comprises an organic dielectric and metal layer structure.15. The device according to claim 4, wherein the high routing densitypatch comprises silicon.
 16. The device according to claim 4, wherein:the high routing density patch comprises an inorganic dielectric layer;the substrate comprises an organic dielectric layer; and the inorganicdielectric layer of the patch is bonded to the organic dielectric layerof the substrate without an intervening adhesive layer.
 17. Anelectronic device comprising: a substrate; a high routing density patchbonded to a first surface of the substrate; a first semiconductor diebonded to the first surface of the substrate and to the high routingdensity patch; a second semiconductor die bonded to the first surface ofthe substrate and to the high routing density patch, wherein: the highrouting density patch comprises a denser trace line density than thesubstrate; the high routing density patch provides electricalinterconnection between the first semiconductor die and the secondsemiconductor die independent of the substrate; and the high routingdensity patch provides electrical interconnection between the firstsemiconductor die and the substrate.
 18. The device according to claim17, comprising bonding a metal contact of the high routing density patchand a metal contact of the substrate to each other.
 19. The deviceaccording to claim 17, wherein the high routing density patch comprisesa high-density routing area near the center of the patch and low-densityrouting areas at opposite sides of the high-density routing area. 20.The device according to claim 17, wherein the high routing density patchhas a thickness of 10 microns or less.